To verify the performance of clean booths in the semiconductor field, the core lies in three dimensions: cleanliness, stability of environmental parameters, and rationality of airflow. This is achieved through standardized testing and actual process adaptation tests to ensure that they meet the strict requirements of semiconductor nanoscale production.

Core cleanliness index detection
This is the basis for verification and should be carried out in accordance with international standards (such as ISO 14644) or specific regulations of the semiconductor industry, with a focus on detecting the number of particles in the air.
Particle concentration test: Use a laser particle counter to sample at different points within the clean booth (such as the working area, supply air outlet, and return air outlet) at specified times. Count the number of particles with key particle sizes such as ≥0.1μm and ≥0.5μm to determine if they meet the target clean grade (such as ISO Class 1 or Class 2 commonly used in semiconductors).
Chemical pollutant detection: Gas chromatography-mass spectrometry (GC-MS) or ion chromatography is used to detect the concentrations of VOCs, metal ions, and acidic/alkaline gases in the air, ensuring that they are below the tolerance threshold of semiconductor processes (usually below the ppb level).
2. Verification of environmental parameter stability
Semiconductor processes are highly sensitive to fluctuations in temperature, humidity and pressure, and require long-term monitoring to ensure parameter stability.
Temperature and humidity testing: Evenly arrange multiple high-precision temperature and humidity sensors (with an accuracy of ±0.1℃ and ± 1%RH) in the clean booth. Continuously monitor for 24 to 72 hours, record the data and analyze the fluctuation range to confirm whether it meets the process requirements (such as temperature 23±0.1℃, humidity 45± 2%RH).
Differential pressure test: Use a differential pressure gauge to detect the pressure difference between the inside and outside of the clean booth and between the clean booth and adjacent auxiliary areas, ensuring that the clean booth maintains a positive pressure (usually 5-10Pa) to prevent external contaminated air from seeping in. If toxic processes are involved, it is necessary to verify whether the negative pressure is stable to prevent the leakage of pollutants.
3. Air flow organization and filtration system performance testing
Reasonable airflow is the key to maintaining cleanliness. It is necessary to verify the uniformity of airflow distribution and the effectiveness of the filtration system.
Airflow velocity and direction test: Use a hot bulb anemometer to measure the airflow velocity at locations such as below the supply air outlet and in the working area (typically requiring 0.3-0.5m/s), and observe the airflow trajectory through smoke testing to ensure there are no vortices or dead corners, thereby preventing the accumulation of pollutants in the working area.
Filter integrity test: Use an aerosol photometer to conduct leakage tests on high-efficiency air filters (HEPA) or ultra-high-efficiency air filters (ULPA). Inject aerosol upstream of the filter and detect the leakage downstream to ensure that the filter is undamaged and has a good installation seal.
4. Actual process compatibility test
After the laboratory test is qualified, it is necessary to verify it in combination with the actual production scenarios of semiconductors to ensure that the clean booth can meet the real process requirements.
Simulation process testing: Place the same wafer carriers and process equipment as in actual production in a clean booth to simulate the operation procedures of key processes such as photolithography and etching. Monitor the changes in cleanliness, temperature and humidity during the process to determine if they interfere with the process.
Long-term operation verification: Let the clean booth operate continuously for 1 to 3 months. During this period, regularly spot-check indicators such as cleanliness, filter resistance, and temperature and humidity stability to assess its reliability and stability during long-term operation and avoid performance degradation due to equipment aging.